SiEngine Technology's AI cockpit-driving integration chip. [Photo/WeChat account: whkfq]
SiEngine Technology Co in Wuhan Economic & Technological Development Zone (WEDZ) has achieved a significant milestone, with over 150,000 of its automotive cockpit domain controllers installed from January to April.
SiEngine Technology has developed China’s first 7-nanometer automotive-grade smart cockpit chip and a 7-nanometer automotive-grade assisted driving chip, focusing on critical areas including smart cockpits and intelligent driving.
The company is also expanding its technological capabilities into sectors such as industrial robotics and AI cockpit-driving integration, positioning itself as one of the few Chinese companies capable of offering a comprehensive range of automotive-grade chip solutions.
Its industrial-grade chips have been integrated into industrial robot products since 2024, demonstrating the versatility and wide applicability of its technological innovations.
Over 1 million of the company's 7-nanometer automotive-grade smart cockpit chips have been shipped and installed or designated in models by Lynk & Co, Hongqi, and Volkswagen, among other brands. Its 7-nanometer automotive-grade assisted driving chip has achieved large-scale mass production.
SiEngine Technology unveiled its 5-nanometer automotive-grade AI cockpit-driving integration chip last month, with plans to commence adaptation in the first quarter of 2027.
This advanced chip is engineered to address the full spectrum of AI cockpit and cockpit-driving integration needs, providing the computational power necessary to support the intelligent evolution of the automotive industry and edge-side intelligent applications.
SiEngine Technology has forged strategic collaborations with global enterprises such as Volkswagen, Yutong Bus, and WeRide, assisting clients in developing intelligent terminals based on multiple chip models.
Wang Kai, founder of SiEngine Technology, said, "SiEngine Technology is extending its automotive-grade technological expertise to edge-side fields including smart homes and embodied intelligence."
