DF30, an automotive-grade MCU chip is launched in the Wuhan Economic & Technological Development Zone on Nov 9. [Photo/WeChat account: whkfq]
China's first high-performance automotive-grade MCU chip, DF30, was launched on Nov 9 in the Wuhan Economic & Technological Development Zone (WEDZ).
The DF30 chip is an industry-first, built on a domestically developed, open-source RISC-V multi-core architecture and manufactured using a 40-nano-meter automotive-grade process. It meets the ASIL-D functional safety standard and has passed 295 rigorous tests.
The chip is compatible with the domestically developed AutoSAR automotive software operating system and can be widely applied in power control, body chassis, electronic information, and driver assistance systems.
Automotive chips are crucial for driving the high-quality development of the automotive industry. In May 2022, Dongfeng Motor Corporation spearheaded the formation of the Hubei Automotive-Grade Chip Industry Technology Innovation Consortium in collaboration with eight enterprises, institutions, and universities.
The consortium has produced over 50 invention patents and led the drafting of six national and industry standards for automotive-grade chips. Its high-side driver chip has been mass-produced and integrated into Dongfeng's new energy vehicle models.
At the launch ceremony, Dongfeng's high-side driver chip received automotive-grade certification, and the consortium's development plan was released. Seventeen new member units were inducted, bringing the total number of consortium members to 44. These members span the entire automotive chip industry chain, covering standards, design, manufacturing, packaging, and application.
The consortium plans to focus on the automotive-grade chip industry chain and expand its collaborative ecosystem to create a comprehensive automotive chip industry technology consortium that integrates government, industry, academia, research, application, capital, and innovation.
